High aspect ratio copper electroplating process for compact coplanar transmission line implementation

H Sagkol; B Rejaei Salmassi; JN Burghartz

High aspect ratio copper electroplating process for compact coplanar transmission line implementation

H Sagkol, B Rejaei Salmassi, JN Burghartz

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005)
Editors	s.n.
Place of Publication	Utrecht
Publisher	Technology Stichting STW
Pages	43-46
Number of pages	4
ISBN (Print)	90-73461-50-2
Publication status	Published - 2005
Event	STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005), Veldhoven, the Netherlands - Utrecht Duration: 17 Nov 2005 → 18 Nov 2005

Publication series

Name
Publisher	Technology Stichting STW

Conference

Conference	STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005), Veldhoven, the Netherlands
Period	17/11/05 → 18/11/05

Keywords

conference contrib. refereed
Vakpubl., Overig wet. > 3 pag

Cite this

@inproceedings{7f49c131789745d8bb256facc50534f9,

title = "High aspect ratio copper electroplating process for compact coplanar transmission line implementation",

keywords = "conference contrib. refereed, Vakpubl., Overig wet. > 3 pag",

author = "H Sagkol and {Rejaei Salmassi}, B and JN Burghartz",

note = "Editor onbekend JH/STW; null ; Conference date: 17-11-2005 Through 18-11-2005",

year = "2005",

language = "Undefined/Unknown",

isbn = "90-73461-50-2",

publisher = "Technology Stichting STW",

pages = "43--46",

editor = "s.n.",

booktitle = "Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005)",

}

Sagkol, H, Rejaei Salmassi, B & Burghartz, JN 2005, High aspect ratio copper electroplating process for compact coplanar transmission line implementation. in s.n. (ed.), Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005). Technology Stichting STW, Utrecht, pp. 43-46, STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005), Veldhoven, the Netherlands, 17/11/05.

High aspect ratio copper electroplating process for compact coplanar transmission line implementation. / Sagkol, H; Rejaei Salmassi, B; Burghartz, JN.

Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005). ed. / s.n. Utrecht : Technology Stichting STW, 2005. p. 43-46.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - High aspect ratio copper electroplating process for compact coplanar transmission line implementation

AU - Sagkol, H

AU - Rejaei Salmassi, B

AU - Burghartz, JN

N1 - Editor onbekend JH/STW

PY - 2005

Y1 - 2005

KW - conference contrib. refereed

KW - Vakpubl., Overig wet. > 3 pag

M3 - Conference contribution

SN - 90-73461-50-2

SP - 43

EP - 46

BT - Proceedings of the STW annual workshop on semiconductor advances for future electronics and sensors (SAFE 2005)

A2 - s.n., null

PB - Technology Stichting STW

CY - Utrecht

Y2 - 17 November 2005 through 18 November 2005

ER -