High aspect ratio lithography for litho-defined wire bonding

ZK Esfahani, HW van Zeijl, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings - 64th Electronic Components and Technology Conference
EditorsW Sauter, A Huffman
Place of PublicationPiscataway, NJ, USA
PublisherIEEE Society
Pages1556-1561
Number of pages6
ISBN (Print)978-147992407-3
DOIs
Publication statusPublished - 2014
EventECTC 2014, Orlando, FL, USA - Piscataway, NJ, USA
Duration: 27 May 201430 May 2014

Publication series

Name
PublisherIEEE

Conference

ConferenceECTC 2014, Orlando, FL, USA
Period27/05/1430/05/14

Bibliographical note

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