High aspect ratio through-wafer interconnections for 3D-microsystems

L Wang, A Nichelatti, H Schellevis, CR de Boer, CCG Visser, NT Nguyen, PM Sarro

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

29 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationMEMS 2003 16th IEEE international micro electronic mechanical systems conference
Editors s.n.
Place of PublicationPiscataway
PublisherIEEE Society
Pages634-637
Number of pages4
ISBN (Print)0-7803-7744-3
Publication statusPublished - 2003
Event16th IEEE international micro electro mechanical systems conference, Kyoto, Japan - Piscataway
Duration: 19 Jan 200323 Jan 2003

Publication series

Name
PublisherIEEE

Conference

Conference16th IEEE international micro electro mechanical systems conference, Kyoto, Japan
Period19/01/0323/01/03

Keywords

  • Elektrotechniek
  • Techniek
  • Conf.proc. > 3 pag

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