High aspect ratio through-wafer interconnections for 3D-microsystems

L Wang; A Nichelatti; H Schellevis; CR de Boer; CCG Visser; NT Nguyen; PM Sarro

High aspect ratio through-wafer interconnections for 3D-microsystems

L Wang, A Nichelatti, H Schellevis, CR de Boer, CCG Visser, NT Nguyen, PM Sarro

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

30 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	MEMS 2003 16th IEEE international micro electronic mechanical systems conference
Editors	s.n.
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	634-637
Number of pages	4
ISBN (Print)	0-7803-7744-3
Publication status	Published - 2003
Event	16th IEEE international micro electro mechanical systems conference, Kyoto, Japan - Piscataway Duration: 19 Jan 2003 → 23 Jan 2003

Publication series

Name
Publisher	IEEE

Conference

Conference	16th IEEE international micro electro mechanical systems conference, Kyoto, Japan
Period	19/01/03 → 23/01/03

Keywords

Elektrotechniek
Techniek
Conf.proc. > 3 pag

Cite this

@inproceedings{57b176af54174db897052919b099224e,

title = "High aspect ratio through-wafer interconnections for 3D-microsystems",

keywords = "Elektrotechniek, Techniek, Conf.proc. > 3 pag",

author = "L Wang and A Nichelatti and H Schellevis and {de Boer}, CR and CCG Visser and NT Nguyen and PM Sarro",

year = "2003",

language = "Undefined/Unknown",

isbn = "0-7803-7744-3",

publisher = "IEEE Society",

pages = "634--637",

editor = "s.n.",

booktitle = "MEMS 2003 16th IEEE international micro electronic mechanical systems conference",

note = "16th IEEE international micro electro mechanical systems conference, Kyoto, Japan ; Conference date: 19-01-2003 Through 23-01-2003",

}

Wang, L, Nichelatti, A, Schellevis, H , de Boer, CR, Visser, CCG, Nguyen, NT & Sarro, PM 2003, High aspect ratio through-wafer interconnections for 3D-microsystems. in s.n. (ed.), MEMS 2003 16th IEEE international micro electronic mechanical systems conference. IEEE Society, Piscataway, pp. 634-637, 16th IEEE international micro electro mechanical systems conference, Kyoto, Japan, 19/01/03.

High aspect ratio through-wafer interconnections for 3D-microsystems. / Wang, L; Nichelatti, A; Schellevis, H et al.
MEMS 2003 16th IEEE international micro electronic mechanical systems conference. ed. / s.n. Piscataway: IEEE Society, 2003. p. 634-637.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - High aspect ratio through-wafer interconnections for 3D-microsystems

AU - Wang, L

AU - Nichelatti, A

AU - Schellevis, H

AU - de Boer, CR

AU - Visser, CCG

AU - Nguyen, NT

AU - Sarro, PM

PY - 2003

Y1 - 2003

KW - Elektrotechniek

KW - Techniek

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-7744-3

SP - 634

EP - 637

BT - MEMS 2003 16th IEEE international micro electronic mechanical systems conference

A2 - s.n., null

PB - IEEE Society

CY - Piscataway

T2 - 16th IEEE international micro electro mechanical systems conference, Kyoto, Japan

Y2 - 19 January 2003 through 23 January 2003

ER -