High-aspect-ratio through-wafer parylene beams for stretchable silicon electronics

T Zoumpoulidis, M Bartek, P de Graaf, R Dekker

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publication22nd international conference EUROSENSORS
EditorsG Gerlach
Place of PublicationDusseldorf, Germany
PublisherVDI e.V
Pages1528-1531
Number of pages4
ISBN (Print)978-3-00-025217-4
Publication statusPublished - 2008
EventEurosensors 2008, Dusseldorf, Germany - Dusseldorf, Germany
Duration: 7 Sep 200810 Sep 2008

Publication series

Name
PublisherVDI e.V

Conference

ConferenceEurosensors 2008, Dusseldorf, Germany
Period7/09/0810/09/08

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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