High Pressure Aluminium Via-Fill for ULSI interconnect using a Liquid Transducer

JF Jongste, X Li, JP Lokker, GCAM Janssen, S Radelaar, ThW de Loos

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Advanced Metalization and Interconnect Systems for ULSI Applications 1996
Editors	JSR Havemann, H Komiyama, K Tsubouchi
Pages	51-56
Number of pages	6
Publication status	Published - 1997

Cite this

@inproceedings{c1686eae4efe493f821fcac25b7294f8,

title = "High Pressure Aluminium Via-Fill for ULSI interconnect using a Liquid Transducer",

author = "JF Jongste and X Li and JP Lokker and GCAM Janssen and S Radelaar and {de Loos}, ThW",

year = "1997",

language = "Undefined/Unknown",

pages = "51--56",

editor = "JSR Havemann and H Komiyama and K Tsubouchi",

booktitle = "Advanced Metalization and Interconnect Systems for ULSI Applications 1996",

}

TY - GEN

T1 - High Pressure Aluminium Via-Fill for ULSI interconnect using a Liquid Transducer

AU - Jongste, JF

AU - Li, X

AU - Lokker, JP

AU - Janssen, GCAM

AU - Radelaar, S

AU - de Loos, ThW

PY - 1997

Y1 - 1997

M3 - Conference contribution

SP - 51

EP - 56

BT - Advanced Metalization and Interconnect Systems for ULSI Applications 1996

A2 - Havemann, JSR

A2 - Komiyama, H

A2 - Tsubouchi, K

ER -