High-resistivity polycrystalline silicon as rf substrate in wafer-level packaging

A Poliakov, SM Sinaga, P Mendes, M Bartek, JH Correia, JN Burghartz

Research output: Contribution to journalArticleScientificpeer-review

5 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)100-101
Number of pages2
JournalElectronics Letters
Issue number2
Publication statusPublished - 2005


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