High-resistivity polycrystalline silicon as rf substrate in wafer-level packaging

A Poliakov, SM Sinaga, P Mendes, M Bartek, JH Correia, JN Burghartz

Research output: Contribution to journal › Article › Scientific › peer-review

Keywords

@article{b97e34ac2a3b49fd92022e795f7f4c58,

title = "High-resistivity polycrystalline silicon as rf substrate in wafer-level packaging",

keywords = "academic journal papers, ZX CWTS JFIS < 1.00",

author = "A Poliakov and SM Sinaga and P Mendes and M Bartek and JH Correia and JN Burghartz",

year = "2005",

language = "Undefined/Unknown",

volume = "41",

pages = "100--101",

journal = "Electronics Letters",

issn = "0013-5194",

publisher = "Institution of Engineering and Technology",

number = "2",

}

TY - JOUR

T1 - High-resistivity polycrystalline silicon as rf substrate in wafer-level packaging

AU - Poliakov, A

AU - Sinaga, SM

AU - Mendes, P

AU - Bartek, M

AU - Correia, JH

AU - Burghartz, JN

PY - 2005

Y1 - 2005

KW - academic journal papers

KW - ZX CWTS JFIS < 1.00

M3 - Article

SN - 0013-5194

VL - 41

SP - 100

EP - 101

JO - Electronics Letters

JF - Electronics Letters

IS - 2

ER -