High-resolution sensing sheet for structural-health monitoring via scalable interfacing of flexible electronics with high-performance ICs

Y. Hu, W. Rieutort-Louis, J. Sanz-Robinson, K. Song, J.C. Sturm, S. Wagner, N. Verma

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

14 Citations (Scopus)

Original language	English
Title of host publication	IEEE Symposium on VLSI Circuits, Digest of Technical Papers
DOIs	https://doi.org/10.1109/VLSIC.2012.6243819
Publication status	Published - 2012

Access to Document

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title = "High-resolution sensing sheet for structural-health monitoring via scalable interfacing of flexible electronics with high-performance ICs",

author = "Y. Hu and W. Rieutort-Louis and J. Sanz-Robinson and K. Song and J.C. Sturm and S. Wagner and N. Verma",

year = "2012",

doi = "10.1109/VLSIC.2012.6243819",

language = "English",

booktitle = "IEEE Symposium on VLSI Circuits, Digest of Technical Papers",

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Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - High-resolution sensing sheet for structural-health monitoring via scalable interfacing of flexible electronics with high-performance ICs

AU - Hu, Y.

AU - Rieutort-Louis, W.

AU - Sanz-Robinson, J.

AU - Song, K.

AU - Sturm, J.C.

AU - Wagner, S.

AU - Verma, N.

PY - 2012

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DO - 10.1109/VLSIC.2012.6243819

M3 - Conference contribution

BT - IEEE Symposium on VLSI Circuits, Digest of Technical Papers

ER -