High-resolution sensing sheet for structural-health monitoring via scalable interfacing of flexible electronics with high-performance ICs

Y. Hu, W. Rieutort-Louis, J. Sanz-Robinson, K. Song, J.C. Sturm, S. Wagner, N. Verma

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

14 Citations (Scopus)

Original language	English
Title of host publication	IEEE Symposium on VLSI Circuits, Digest of Technical Papers
Publication status	Published - 2012
Externally published	Yes

Cite this

@inproceedings{ba6980bef00a4f6f985213acbd2ae29a,

title = "High-resolution sensing sheet for structural-health monitoring via scalable interfacing of flexible electronics with high-performance ICs",

author = "Y. Hu and W. Rieutort-Louis and J. Sanz-Robinson and K. Song and J.C. Sturm and S. Wagner and N. Verma",

year = "2012",

language = "English",

booktitle = "IEEE Symposium on VLSI Circuits, Digest of Technical Papers",

}

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - High-resolution sensing sheet for structural-health monitoring via scalable interfacing of flexible electronics with high-performance ICs

AU - Hu, Y.

AU - Rieutort-Louis, W.

AU - Sanz-Robinson, J.

AU - Song, K.

AU - Sturm, J.C.

AU - Wagner, S.

AU - Verma, N.

PY - 2012

Y1 - 2012

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-84866630288&partnerID=MN8TOARS

M3 - Conference contribution

BT - IEEE Symposium on VLSI Circuits, Digest of Technical Papers

ER -