High Step Coverage Interconnects By Printed Nanoparticles

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

The growing diversity in the used materials in semiconductor packaging provides challenges for achieving good interconnection. Particularly the very soft substrates, such as paper and polymers, and very hard, such as silicon carbide, offer unique challenges to wire-bonding or formation of vertical interconnects. Complementary technologies are therefore needed. Here, a method to direct-write metal tracks on the top and sides of dies is demonstrated. It is based on a spark ablation aerosol printing process entirely performed at room temperature and without any applied force. Therefore, it is suitable for use on soft or temperature-sensitive substrates. The printed metal lines consist of pure Au nanoparticles, without surfactants or contaminants, and do not require any further curing, cleaning, or other processing. The process is demonstrated on Si dies and paper, but is theoretically applicable on a wide variety of substrate materials. It can provide an alternative method to create interconnects or vias on soft materials, temperature sensitive materials, irregularly shaped materials, or curved surfaces.
Original languageEnglish
Title of host publication2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Subtitle of host publicationProceedings
PublisherIEEE
Pages1-4
Number of pages4
ISBN (Electronic)978-0-9568086-7-7
ISBN (Print)978-1-6654-2368-7
DOIs
Publication statusPublished - 2021
Event2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) - Online at Gothenburg, Sweden
Duration: 13 Sep 202116 Sep 2021
Conference number: 23rd

Conference

Conference2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Abbreviated titleEMPC 2021
CountrySweden
CityOnline at Gothenburg
Period13/09/2116/09/21

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care

Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

  • Nanoparticles
  • flexible electronics
  • interconnect
  • thin-film
  • printing
  • spark ablation

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