High Step Coverage Interconnects By Printed Nanoparticles

INIS

• substrates 100%
• nanoparticles 100%
• metals 66%
• dies 66%
• surfaces 33%
• bonding 33%
• ablation 33%
• temperature range 0273-0400 k 33%
• tracks 33%
• wires 33%
• processing 33%
• surfactants 33%
• curing 33%
• polymers 33%
• semiconductor materials 33%
• aerosols 33%
• cleaning 33%
• packaging 33%
• silicon carbides 33%

Engineering

• Interconnects 100%
• Nanoparticle 100%
• Substrates 66%
• Applied Force 33%
• Surfactant 33%
• Bonding Wire 33%
• Processing 33%
• Printing Process 33%
• Cleaning 33%
• Soft Material 33%
• Substrate Material 33%
• Aerosol 33%
• Contaminant 33%
• Interconnection 33%
• Semiconductor 33%

Material Science

• Temperature 60%
• Paper 40%
• Metal 40%
• Semiconductor Material 20%
• Impurity 20%
• Silicon Carbide 20%
• Aerosol 20%
• Surface Active Agent 20%