High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package

Adwait Inamdar, Yu Hsiang Yang, Alexandru Prisacaru, Przemyslaw Gromala, Bongtae Han*

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

3 Citations (Scopus)

Fingerprint

Dive into the research topics of 'High temperature aging of epoxy-based molding compound and its effect on mechanical behavior of molded electronic package'. Together they form a unique fingerprint.

Engineering & Materials Science

Physics & Astronomy

Chemical Compounds