Abstract
SnBiAgCu solder alloy is an attractive soldering material for temperature-sensitive electronic devices due to its excellent creep properties. This study firstly reports the creep properties of SnBiAgCu solder alloy under different temperatures. Results show that the addition of Bi resulted in better creep resistance compared with that of commercial SAC305 (Sn-3.0Ag-0.5Cu). Secondly, dynamic mechanical analyses were performed to get the storage modulus and glass transition temperature of potting compounds. Finally, a finite element modeling based analysis were used to figure out the different failure mechanism due to the presence of potting materials. The accurate simulation data offers an optimization reference for the selection of solder and potting materials.
Original language | English |
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Title of host publication | Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023 |
Publisher | IEEE |
Pages | 392-395 |
Number of pages | 4 |
ISBN (Electronic) | 9798350334982 |
DOIs | |
Publication status | Published - 2023 |
Event | 73rd IEEE Electronic Components and Technology Conference, ECTC 2023 - Orlando, United States Duration: 30 May 2023 → 2 Jun 2023 |
Publication series
Name | Proceedings - Electronic Components and Technology Conference |
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Volume | 2023-May |
ISSN (Print) | 0569-5503 |
Conference
Conference | 73rd IEEE Electronic Components and Technology Conference, ECTC 2023 |
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Country/Territory | United States |
City | Orlando |
Period | 30/05/23 → 2/06/23 |
Bibliographical note
Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-careOtherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Keywords
- creep
- potting material
- solder
- thermal fatigue