High temperature, high power density packaging for automotive applications

MB Gerber, JA Ferreira, IW Hofsajer, N Seliger

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    9 Citations (Scopus)
    Original languageUndefined/Unknown
    Title of host publicationPESC'03 34th IEEE power electronics specialists conference
    Editors s.n.
    Place of PublicationPiscataway
    PublisherIEEE Society
    Pages1-8
    Number of pages8
    ISBN (Print)0-7803-7755-9
    Publication statusPublished - 2003
    Event34th IEEE power electronics specialists conference, Acapulco, Mexico - Piscataway
    Duration: 15 Jun 200319 Jun 2003

    Publication series

    Name
    PublisherIEEE

    Conference

    Conference34th IEEE power electronics specialists conference, Acapulco, Mexico
    Period15/06/0319/06/03

    Keywords

    • Conf.proc. > 3 pag

    Cite this

    Gerber, MB., Ferreira, JA., Hofsajer, IW., & Seliger, N. (2003). High temperature, high power density packaging for automotive applications. In s.n. (Ed.), PESC'03 34th IEEE power electronics specialists conference (pp. 1-8). IEEE Society.