How different fillers affect the thermal conductivity of epoxy composites

IA Tsekmes; R Kochetov; PHF Morshuis; JJ Smit; T Iizuka; K Tatsumi; T Tanaka

doi:10.1109/CEIDP.2014.6995843

How different fillers affect the thermal conductivity of epoxy composites

IA Tsekmes, R Kochetov, PHF Morshuis, JJ Smit, T Iizuka, K Tatsumi, T Tanaka

Electrical Engineering, Mathematics and Computer Science

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

9 Citations (Scopus)

Original language	English
Title of host publication	2014 Annual Report Conference on Electrical Insulation and Dielectric Phenomena
Editors	M Frechette
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE
Pages	647-650
Number of pages	4
ISBN (Print)	978-1-4799-7525-9
DOIs	https://doi.org/10.1109/CEIDP.2014.6995843
Publication status	Published - 2014
Event	IEEE CEIDP 2014, Des Moines, IA, USA - Piscataway, NJ, USA Duration: 19 Oct 2014 → 22 Oct 2014

Publication series

Name
Publisher	IEEE

Conference

Conference	IEEE CEIDP 2014, Des Moines, IA, USA
Period	19/10/14 → 22/10/14

Access to Document

10.1109/CEIDP.2014.6995843

Cite this

@inproceedings{b99f0257af514710946e324a99297512,

title = "How different fillers affect the thermal conductivity of epoxy composites",

author = "IA Tsekmes and R Kochetov and PHF Morshuis and JJ Smit and T Iizuka and K Tatsumi and T Tanaka",

year = "2014",

doi = "10.1109/CEIDP.2014.6995843",

language = "English",

isbn = "978-1-4799-7525-9",

publisher = "IEEE",

pages = "647--650",

editor = "M Frechette",

booktitle = "2014 Annual Report Conference on Electrical Insulation and Dielectric Phenomena",

address = "United States",

note = "IEEE CEIDP 2014, Des Moines, IA, USA ; Conference date: 19-10-2014 Through 22-10-2014",

}

Tsekmes, IA, Kochetov, R, Morshuis, PHF, Smit, JJ, Iizuka, T, Tatsumi, K & Tanaka, T 2014, How different fillers affect the thermal conductivity of epoxy composites. in M Frechette (ed.), 2014 Annual Report Conference on Electrical Insulation and Dielectric Phenomena. IEEE, Piscataway, NJ, USA, pp. 647-650, IEEE CEIDP 2014, Des Moines, IA, USA, 19/10/14. https://doi.org/10.1109/CEIDP.2014.6995843

How different fillers affect the thermal conductivity of epoxy composites. / Tsekmes, IA; Kochetov, R; Morshuis, PHF et al.
2014 Annual Report Conference on Electrical Insulation and Dielectric Phenomena. ed. / M Frechette. Piscataway, NJ, USA: IEEE, 2014. p. 647-650.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - How different fillers affect the thermal conductivity of epoxy composites

AU - Tsekmes, IA

AU - Kochetov, R

AU - Morshuis, PHF

AU - Smit, JJ

AU - Iizuka, T

AU - Tatsumi, K

AU - Tanaka, T

PY - 2014

Y1 - 2014

U2 - 10.1109/CEIDP.2014.6995843

DO - 10.1109/CEIDP.2014.6995843

M3 - Conference contribution

SN - 978-1-4799-7525-9

SP - 647

EP - 650

BT - 2014 Annual Report Conference on Electrical Insulation and Dielectric Phenomena

A2 - Frechette, M

PB - IEEE

CY - Piscataway, NJ, USA

T2 - IEEE CEIDP 2014, Des Moines, IA, USA

Y2 - 19 October 2014 through 22 October 2014

ER -