How significant will be the test cost share for 3D Die-to-Wafer stacked-ICs?

M Taouil; S Hamdioui; E Marinissen

doi:10.1109/DTIS.2011.5941432

How significant will be the test cost share for 3D Die-to-Wafer stacked-ICs?

Computer Engineering

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

6 Citations (Scopus)

Original language	English
Title of host publication	6th International conference on Design & Technology of Integrated Systems in nanoscale era
Editors	I Voyiatzis, H-J Wunderlich
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Society
Pages	1-6
Number of pages	6
ISBN (Print)	978-1-61284-899-0
DOIs	https://doi.org/10.1109/DTIS.2011.5941432
Publication status	Published - 2011
Event	DTIS11 - Piscataway, NJ, USA Duration: 6 Apr 2011 → 8 Apr 2011

Publication series

Name
Publisher	IEEE

Conference

Conference	DTIS11
Period	6/04/11 → 8/04/11

Keywords

Elektrotechniek
Techniek
Conf.proc. > 3 pag

Access to Document

10.1109/DTIS.2011.5941432

Cite this

@inproceedings{15d77c6528e743fb8e76ed40c1fd2902,

title = "How significant will be the test cost share for 3D Die-to-Wafer stacked-ICs?",

keywords = "Elektrotechniek, Techniek, Conf.proc. > 3 pag",

author = "M Taouil and S Hamdioui and E Marinissen",

year = "2011",

doi = "10.1109/DTIS.2011.5941432",

language = "English",

isbn = "978-1-61284-899-0",

publisher = "IEEE Society",

pages = "1--6",

editor = "I Voyiatzis and H-J Wunderlich",

booktitle = "6th International conference on Design & Technology of Integrated Systems in nanoscale era",

note = "DTIS11 ; Conference date: 06-04-2011 Through 08-04-2011",

}

How significant will be the test cost share for 3D Die-to-Wafer stacked-ICs? / Taouil, M ; Hamdioui, S; Marinissen, E.
6th International conference on Design & Technology of Integrated Systems in nanoscale era. ed. / I Voyiatzis; H-J Wunderlich. Piscataway, NJ, USA: IEEE Society, 2011. p. 1-6.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review