@inproceedings{ef37f218eac84878bdcb43517125063d,
title = "Hybrid wafer-level packaging based on a capping substrate with cavities",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "S Sosin and J Tian and M Bartek",
year = "2006",
language = "Undefined/Unknown",
isbn = "91-631-9281-0",
publisher = "Chalmers University of Technology",
pages = "M3CP6/1--M3CP6/4",
editor = "s.n.",
booktitle = "The 20th European Conference on Solid-State Transducers (Eurosensors XX)",
note = "The 20th European Conference on Solid-State Transducers (Eurosensors XX) ; Conference date: 17-09-2006 Through 20-09-2006",
}