Hybrid wafer level packaging for RF MEMS applications

J Iannacci, M Bartek, J Tian, S Sosin, AB Akhnoukh, R Gaddi, A Gnudi

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    4 Citations (Scopus)
    Original languageUndefined/Unknown
    Title of host publicationProc. 39th International Symposium on Microelectronics
    Editors s.n.
    Place of PublicationWashington
    PublisherIMAPS
    Pages246-253
    Number of pages8
    ISBN (Print)0-930815-80-7
    Publication statusPublished - 2006
    Event39th International Symposium on Microelectronics (IMAPS 2006), San Diego, CA - Washington
    Duration: 9 Oct 200613 Oct 2006

    Publication series

    Name
    PublisherIMAPS

    Conference

    Conference39th International Symposium on Microelectronics (IMAPS 2006), San Diego, CA
    Period9/10/0613/10/06

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

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