Hybrid wafer-level packaging for RF MEMS applications

J Iannacci; M Bartek; J Tian; S Sosin; AB Akhnoukh; R Gaddi; A Gnudi

Hybrid wafer-level packaging for RF MEMS applications

J Iannacci, M Bartek, J Tian, S Sosin, AB Akhnoukh, R Gaddi, A Gnudi

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	The Third Annual International Wafer-Level Packaging Conference (IWLPC 2006) - 2006 Conference Proceedings
Editors	s.n.
Place of Publication	Edina
Publisher	SMTA (smta.org)
Pages	106-113
Number of pages	8
ISBN (Print)	0-9789465-2-9
Publication status	Published - 2006
Event	The Third Annual International Wafer-Level Packaging Conference (IWLPC 2006), San Jose, CA - Edina Duration: 1 Nov 2006 → 3 Nov 2006

Publication series

Name
Publisher	SMTA (smta.org)

Conference

Conference	The Third Annual International Wafer-Level Packaging Conference (IWLPC 2006), San Jose, CA
Period	1/11/06 → 3/11/06

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{d752bf0b4c674675963f23bb5123caa7,

title = "Hybrid wafer-level packaging for RF MEMS applications",

keywords = "Conf.proc. > 3 pag",

author = "J Iannacci and M Bartek and J Tian and S Sosin and AB Akhnoukh and R Gaddi and A Gnudi",

year = "2006",

language = "Undefined/Unknown",

isbn = "0-9789465-2-9",

publisher = "SMTA (smta.org)",

pages = "106--113",

editor = "s.n.",

booktitle = "The Third Annual International Wafer-Level Packaging Conference (IWLPC 2006) - 2006 Conference Proceedings",

note = "The Third Annual International Wafer-Level Packaging Conference (IWLPC 2006), San Jose, CA ; Conference date: 01-11-2006 Through 03-11-2006",

}

Iannacci, J, Bartek, M, Tian, J, Sosin, S, Akhnoukh, AB, Gaddi, R & Gnudi, A 2006, Hybrid wafer-level packaging for RF MEMS applications. in s.n. (ed.), The Third Annual International Wafer-Level Packaging Conference (IWLPC 2006) - 2006 Conference Proceedings. SMTA (smta.org), Edina, pp. 106-113, The Third Annual International Wafer-Level Packaging Conference (IWLPC 2006), San Jose, CA, 1/11/06.

Hybrid wafer-level packaging for RF MEMS applications. / Iannacci, J; Bartek, M; Tian, J et al.
The Third Annual International Wafer-Level Packaging Conference (IWLPC 2006) - 2006 Conference Proceedings. ed. / s.n. Edina: SMTA (smta.org), 2006. p. 106-113.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Hybrid wafer-level packaging for RF MEMS applications

AU - Iannacci, J

AU - Bartek, M

AU - Tian, J

AU - Sosin, S

AU - Akhnoukh, AB

AU - Gaddi, R

AU - Gnudi, A

PY - 2006

Y1 - 2006

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-9789465-2-9

SP - 106

EP - 113

BT - The Third Annual International Wafer-Level Packaging Conference (IWLPC 2006) - 2006 Conference Proceedings

A2 - s.n., null

PB - SMTA (smta.org)

CY - Edina

T2 - The Third Annual International Wafer-Level Packaging Conference (IWLPC 2006), San Jose, CA

Y2 - 1 November 2006 through 3 November 2006

ER -