Hygroscopic Effects on Swelling and Viscoelasticity of Electronic Packaging Epoxy

X Ma, KMB Jansen, GQ Zhang, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

12 Citations (Scopus)

Abstract

One type of polymer EPN1180 is slected for the hygroscopic swelling tests and the sample is made in the thickness of 30 mumeter. Coefficient of thermal expansion is tested by using DMA Q800 and coefficient of moisture expansion is tested by using DMA Q800 jointed with a humidity generator. Three conditions temperature, 50 degrees C, 60 degrees C and 70 degrees C, and different relative humidity with 20RH% steps are used for the tests and moisture induced expansion is characterized. The characterized equation can be used to expect the moisture-induced expansion at temperature between 0 degrees C and 100 degrees C, at relative humidity between 0RH% and 100RH% for this epoxy. This new method is convenient than that of the old method and easily is used to characterize other polymers. In addition hygroscopic effect on the viscoelasticity is tested and characterized. The storage modulus is linear decreased with the increase of relative humidity at certain temperature.
Original languageUndefined/Unknown
Title of host publicationProceedings of 2006 7th International Conference on Electronics Packaging Technology
Editors Sheng Liu
Place of PublicationShanghai, China
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages262-266
Number of pages5
ISBN (Print)1-4244-0620-X
Publication statusPublished - 2006
Event2006 7th International Conference on Electronics Packaging Technology - Shanghai. China
Duration: 26 Aug 200629 Aug 2006

Publication series

Name
PublisherInstitute of Electrical and Electronics Engineers, Inc.

Conference

Conference2006 7th International Conference on Electronics Packaging Technology
Period26/08/0629/08/06

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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