In cases where we can achieve integrated sensors using only layers already in the standard IC layers, the only compatibility issues may be the requirement for additional etch steps. In cases where additional layers are required, either for sensing or protection, we have to consider the compatibility of the materials. These issues can be thermal budget during processing, mechanical stress or chemical contamination. In some cases, this led to the option of hybrid, where the sensor and electronics are on separate chips, but combined in a single package. This paper will examine the development of integrated sensors, and the issues combining additional layers with a standard IC process.
|Number of pages||6|
|Publication status||Published - 19 May 2020|
- Process integration
- material compatibility
- IC processing