TY - JOUR
T1 - Identifying interfacial failure mode in aerospace adhesive bonds by broadband dielectric spectroscopy
AU - Nijemeisland, Marlies
AU - Meteleva-Fischer, Yulia V.
AU - Garcia, Santiago J.
PY - 2022
Y1 - 2022
N2 - The most widely accepted test for bond durability analysis in aerospace metal-bonded structures is the bondline corrosion test introduced in the late 90s. Little progress has been made however on non-destructive testing methods that allow determining the bond quality after years of use. Here, a non-destructive method based on dielectric spectroscopy is introduced to evaluate the state of a metal-adhesive-metal bond exposed to salt fog spray up to 180 days. Several samples were evaluated with broadband dielectric spectroscopy (BDS), floating roller peel (FRP) tests and bondline corrosion (BLC) after exposure to salt fog spray test for different times. Relaxation processes and conductivity phenomena extracted from the BDS data (e.g. apparent conductivity relaxation time (τmax) using electric modulus) are found to correlate well with the bond strength measured in peel test and BLC progression. The BDS-based protocol was able to identify the local interfacial degradation stages in a non-destructive mode and with high resolution. The protocol has the potential to be further developed into a test method for durability on coupon level.
AB - The most widely accepted test for bond durability analysis in aerospace metal-bonded structures is the bondline corrosion test introduced in the late 90s. Little progress has been made however on non-destructive testing methods that allow determining the bond quality after years of use. Here, a non-destructive method based on dielectric spectroscopy is introduced to evaluate the state of a metal-adhesive-metal bond exposed to salt fog spray up to 180 days. Several samples were evaluated with broadband dielectric spectroscopy (BDS), floating roller peel (FRP) tests and bondline corrosion (BLC) after exposure to salt fog spray test for different times. Relaxation processes and conductivity phenomena extracted from the BDS data (e.g. apparent conductivity relaxation time (τmax) using electric modulus) are found to correlate well with the bond strength measured in peel test and BLC progression. The BDS-based protocol was able to identify the local interfacial degradation stages in a non-destructive mode and with high resolution. The protocol has the potential to be further developed into a test method for durability on coupon level.
KW - Adhesive bonding
KW - Dielectric spectroscopy
KW - Durability
KW - Interfacial failure
KW - Non-destructive testing
UR - http://www.scopus.com/inward/record.url?scp=85136540412&partnerID=8YFLogxK
U2 - 10.1016/j.ijadhadh.2022.103246
DO - 10.1016/j.ijadhadh.2022.103246
M3 - Article
AN - SCOPUS:85136540412
SN - 0143-7496
VL - 118
JO - International Journal of Adhesion and Adhesives
JF - International Journal of Adhesion and Adhesives
M1 - 103246
ER -