In this paper, we present the Immediate Neighbourhood Temperature (INT) routing algorithm which balances thermal profiles across dynamically-throttled 3D NoCs by adaptively routing interconnect traffic based on runtime temperature monitoring. INT avoids the overheads of system-wide temperature monitoring by relying on the heat transfer characteristics of 3D integrated circuits which enable temperature information from routers in the immediate neighbourhood to guide adaptive routing decisions. Experimental results indicate that INT yields balanced thermal profiles with upto 25% lower gradients than competing schemes, and shortens communication latencies by decreasing average network congestion by upto 50%, with negligible overheads.
|Number of pages||5|
|Journal||IEEE Transactions on Circuits and Systems Part 2: Express Briefs|
|Publication status||Published - 2017|
- 3D Networks-on-chip
- adaptive routing
- thermal management
- power management