Impact of various test flows on the cost in 3D die-to-wafer stacking

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	Proceedings Intl. test conference 2010
Editors	s.n.
Place of Publication	Piscataway
Publisher	IEEE
Pages	1-6
Number of pages	6
ISBN (Print)	978-1-4244-7205-5
Publication status	Published - 2010
Event	3D-Test 2010 - Piscataway Duration: 4 Nov 2010 → 5 Nov 2010

Name
Publisher	IEEE

Conference	3D-Test 2010
Period	4/11/10 → 5/11/10

Keywords

@inproceedings{65a2fb7a553f4afb9284d106136f6724,

title = "Impact of various test flows on the cost in 3D die-to-wafer stacking",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "M Taouil and S Hamdioui and E Marinissen",

year = "2010",

language = "English",

isbn = "978-1-4244-7205-5",

publisher = "IEEE",

pages = "1--6",

editor = "s.n.",

booktitle = "Proceedings Intl. test conference 2010",

address = "United States",

note = "3D-Test 2010 ; Conference date: 04-11-2010 Through 05-11-2010",

}

TY - GEN

T1 - Impact of various test flows on the cost in 3D die-to-wafer stacking

AU - Taouil, M

AU - Hamdioui, S

AU - Marinissen, E

PY - 2010

Y1 - 2010

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-7205-5

SP - 1

EP - 6

BT - Proceedings Intl. test conference 2010

A2 - s.n., null

PB - IEEE

CY - Piscataway

T2 - 3D-Test 2010

Y2 - 4 November 2010 through 5 November 2010

ER -