Implementation of General Coupling Model of Electromigration in ANSYS

Zhen Cui, Xuejun Fan, Guoqi Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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Abstract

In this paper, a recently developed theory - general coupling model of electromigration, is implemented in ANSYS. We first identify several errors provided in ANSYS manual for electromigration modeling. Then the general coupling model is implemented in ANSYS and the detailed description is presented. Finally, a 1-D confined metal line with a perfectly blocking condition is presented as a benchmark problem, in which the finite element solutions are in excellent agreement with the analytical solutions.

Original languageEnglish
Title of host publication2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
EditorsL. O'Conner, H. Torres
Place of PublicationPiscataway
PublisherIEEE
Pages1632-1637
Number of pages6
ISBN (Electronic)978-1-7281-6180-8
ISBN (Print)978-1-7281-6181-5
DOIs
Publication statusPublished - 2020
Event70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
Duration: 3 Jun 202030 Jun 2020

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
CountryUnited States
CityOrlando
Period3/06/2030/06/20

Keywords

  • electromigration
  • finite element analysis
  • general coupling theory
  • multiphysics modeling

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  • Cite this

    Cui, Z., Fan, X., & Zhang, G. (2020). Implementation of General Coupling Model of Electromigration in ANSYS. In L. O'Conner, & H. Torres (Eds.), 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (pp. 1632-1637). [9159445] IEEE. https://doi.org/10.1109/ECTC32862.2020.00256