In-air sintering of copper nanoparticle paste with pressure-assistance for die attachment in high power electronics

Boyao Zhang, Andrei Damian, Jurrian Zijl, Henk van Zeijl, Yu Zhang, Jiajie Fan, Guoqi Zhang*

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

18 Citations (Scopus)
364 Downloads (Pure)

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