In-package MEMS-based thermal actuators for micro-assembly

VA Henneken, M Tichem, PM Sarro

Research output: Contribution to journalArticleScientificpeer-review


Abstract. The paper describes the first fabrication and experimental results in the on-going development of MEMS-based electrothermal actuation devices for lateral XY positioning of an optical fibre to a laser diode chip to improve their coupling efficiency and reduce the overall packaging cost. The deflection performance of bulk silicon U- and V-beam thermal actuators with and without fibre loading has been experimentally determined. This is a part of an investigation of the feasibility of an alternative method of performing micro-assembly tasks, i.e. by means of product-internal assembly functions.
Original languageUndefined/Unknown
Pages (from-to)S107-S115
JournalJournal of Micromechanics and Microengineering
Issue number6
Publication statusPublished - 2006


  • academic journal papers
  • CWTS 0.75 <= JFIS < 2.00

Cite this