Induced Delamination of Silicon-Molding Compound Interfaces

G Schlottig, H Pape, B Wunderle, LJ Ernst

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

8 Citations (Scopus)


Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed mode chisel testing setup (MMC) and its experimental procedure. The MMC addresses several drawbacks of existing methods. The work includes samples from package fabrication processes and the establishing of critical fracture mechanics properties through finite element simulation the setup allows for the investigation of interfaces at package scale.
Original languageUndefined/Unknown
Title of host publicationProceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands
Editors Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., Saint Leger, O. de
PublisherIEEE Society
Number of pages4
ISBN (Print)978-1-4244-4159-4
Publication statusPublished - 2009

Publication series



  • conference contrib. refereed
  • Conf.proc. > 3 pag

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