Induced Delamination of Silicon-Molding Compound Interfaces

G Schlottig; H Pape; B Wunderle; LJ Ernst

Induced Delamination of Silicon-Molding Compound Interfaces

G Schlottig, H Pape, B Wunderle, LJ Ernst

Computational Design and Mechanics

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

8 Citations (Scopus)

Abstract

Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed mode chisel testing setup (MMC) and its experimental procedure. The MMC addresses several drawbacks of existing methods. The work includes samples from package fabrication processes and the establishing of critical fracture mechanics properties through finite element simulation the setup allows for the investigation of interfaces at package scale.

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands
Editors	Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., Saint Leger, O. de
Publisher	IEEE Society
Pages	731-734
Number of pages	4
ISBN (Print)	978-1-4244-4159-4
Publication status	Published - 2009

Publication series

Name
Publisher	IEEE

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Schlottig, G., Pape, H., Wunderle, B., & Ernst, LJ. (2009). Induced Delamination of Silicon-Molding Compound Interfaces. In Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., & Saint Leger, O. de (Eds.), Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands (pp. 731-734). IEEE Society.

Schlottig, G ; Pape, H ; Wunderle, B et al. / Induced Delamination of Silicon-Molding Compound Interfaces. Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. editor / Ernst, L.J. ; Zhang, G.Q. ; Driel, W.D. van ; Rodgers, P. ; Bailey, C. ; Saint Leger, O. de. IEEE Society, 2009. pp. 731-734

@inproceedings{79edee455cb7439292c0dfb8458dd89b,

title = "Induced Delamination of Silicon-Molding Compound Interfaces",

abstract = "Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed mode chisel testing setup (MMC) and its experimental procedure. The MMC addresses several drawbacks of existing methods. The work includes samples from package fabrication processes and the establishing of critical fracture mechanics properties through finite element simulation the setup allows for the investigation of interfaces at package scale.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "G Schlottig and H Pape and B Wunderle and LJ Ernst",

year = "2009",

language = "Undefined/Unknown",

isbn = "978-1-4244-4159-4",

publisher = "IEEE Society",

pages = "731--734",

editor = "{Ernst, L.J.} and {Zhang, G.Q.} and {Driel, W.D. van} and {Rodgers, P.} and {Bailey, C.} and {Saint Leger, O. de}",

booktitle = "Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands",

}

Schlottig, G, Pape, H, Wunderle, B & Ernst, LJ 2009, Induced Delamination of Silicon-Molding Compound Interfaces. in Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C. & Saint Leger, O. de (eds), Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. IEEE Society, pp. 731-734.

Induced Delamination of Silicon-Molding Compound Interfaces. / Schlottig, G; Pape, H; Wunderle, B et al.
Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. ed. / Ernst, L.J.; Zhang, G.Q.; Driel, W.D. van; Rodgers, P.; Bailey, C.; Saint Leger, O. de. IEEE Society, 2009. p. 731-734.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Induced Delamination of Silicon-Molding Compound Interfaces

AU - Schlottig, G

AU - Pape, H

AU - Wunderle, B

AU - Ernst, LJ

PY - 2009

Y1 - 2009

N2 - Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed mode chisel testing setup (MMC) and its experimental procedure. The MMC addresses several drawbacks of existing methods. The work includes samples from package fabrication processes and the establishing of critical fracture mechanics properties through finite element simulation the setup allows for the investigation of interfaces at package scale.

AB - Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed mode chisel testing setup (MMC) and its experimental procedure. The MMC addresses several drawbacks of existing methods. The work includes samples from package fabrication processes and the establishing of critical fracture mechanics properties through finite element simulation the setup allows for the investigation of interfaces at package scale.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-4159-4

SP - 731

EP - 734

BT - Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands

A2 - Ernst, L.J., null

A2 - Zhang, G.Q., null

A2 - Driel, W.D. van, null

A2 - Rodgers, P., null

A2 - Bailey, C., null

A2 - Saint Leger, O. de, null

PB - IEEE Society

ER -

Schlottig G, Pape H, Wunderle B, Ernst LJ. Induced Delamination of Silicon-Molding Compound Interfaces. In Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., Saint Leger, O. de, editors, Proceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands. IEEE Society. 2009. p. 731-734