Industrial applications of moisture-related reliability problems

WD van Driel, D Yang, CA Yuan, GQ Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

Original languageEnglish
Title of host publicationMoisture Sensitivity of Plastic Packages of IC Devices
EditorsXJ Fan, E Suhir
Place of PublicationNew York Dordrecht Heidelberg London
Number of pages555
ISBN (Print)978-1-4419-5718-4
Publication statusPublished - 2010


  • edited books
  • Boekdeel internat.wet

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