Influence of Cure Dependency of molding Compound Properties on Warpage and Stress Distribution During and After the Encapsulation of Electronics Components

TC Falat, KMB Jansen, J de Vreugd, S Rzepka

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

10 Citations (Scopus)


Commercial FEM software codes do not directly support the cure dependency of polymers behavior. In electronics packaging, for example, cure shrinkage of the molding compound is consequently treated as a surplus to thermal contraction and its changes in visco-elastic behavior during curing are usually ignored. This gives rise to inaccurate results and may cause difficulties even in recognizing factors important for further optimization. This work introduces a cure dependent visco-elastic material model being implemented into ANSYS by USERMAT, the user material subroutine. The results obtained when simulating the warpage of bi-material strips during and after curing with the full scale material model were compared to those obtained with simplified material models. Varying the geometric configuration different changes in the deformation results have been found caused by cure dependency anywhere between -10%, 0%, and +20%. Hence, correct results can only be achieved in general case with models accounting for cure dependency directly.
Original languageUndefined/Unknown
Title of host publicationProceedings of the 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2009, 27-29 April 2009, Delft, The Netherlands
Editors Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P., Bailey, C., Saint Leger, O. de
PublisherIEEE Society
Number of pages6
ISBN (Print)978-1-4244-4159-4
Publication statusPublished - 2009

Publication series



  • conference contrib. refereed
  • Conf.proc. > 3 pag

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