Influence of the passivation material on Stress voiding in AI-Cu alloys.

JP Lokker, GCAM Janssen, S Radelaar

    Research output: Contribution to journalArticleScientificpeer-review

    4 Citations (Scopus)
    Original languageUndefined/Unknown
    Pages (from-to)257-260
    Number of pages4
    JournalMicroelectronic Engineering
    Volume50
    Issue number2000
    Publication statusPublished - 2000

    Keywords

    • ZX Int.klas.verslagjaar < 2002

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