Influence of via-connections on electrical performance of vertically-spaced rf passives

M Bartek, SM Sinaga, JN Burghartz

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    1 Citation (Scopus)
    Original languageUndefined/Unknown
    Title of host publicationProceedings of the the 55th electronic components and technology conference (ECTC 2005)
    Editors s.n.
    Place of PublicationPiscataway
    PublisherIEEE Society
    Pages1584-1589
    Number of pages6
    ISBN (Print)0-7803-8906-9
    Publication statusPublished - 2005
    Event55th electronic components and technology conference (ECTC 2005), Lake Buena Vista, FL, USA - Piscataway
    Duration: 31 May 20053 Jun 2005

    Publication series

    Name
    PublisherIEEE

    Conference

    Conference55th electronic components and technology conference (ECTC 2005), Lake Buena Vista, FL, USA
    Period31/05/053/06/05

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

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