Influence of via-connections on electrical performance of vertically-spaced rf passives

M Bartek; SM Sinaga; JN Burghartz

Influence of via-connections on electrical performance of vertically-spaced rf passives

M Bartek, SM Sinaga, JN Burghartz

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

2 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proceedings of the the 55th electronic components and technology conference (ECTC 2005)
Editors	s.n.
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	1584-1589
Number of pages	6
ISBN (Print)	0-7803-8906-9
Publication status	Published - 2005
Event	55th electronic components and technology conference (ECTC 2005), Lake Buena Vista, FL, USA - Piscataway Duration: 31 May 2005 → 3 Jun 2005

Publication series

Name
Publisher	IEEE

Conference

Conference	55th electronic components and technology conference (ECTC 2005), Lake Buena Vista, FL, USA
Period	31/05/05 → 3/06/05

Bibliographical note

Editor onbekend JH

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{0ed886a458a84128ad3a2a74ab9ad06f,

title = "Influence of via-connections on electrical performance of vertically-spaced rf passives",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "M Bartek and SM Sinaga and JN Burghartz",

note = "Editor onbekend JH; 55th electronic components and technology conference (ECTC 2005), Lake Buena Vista, FL, USA ; Conference date: 31-05-2005 Through 03-06-2005",

year = "2005",

language = "Undefined/Unknown",

isbn = "0-7803-8906-9",

publisher = "IEEE Society",

pages = "1584--1589",

editor = "s.n.",

booktitle = "Proceedings of the the 55th electronic components and technology conference (ECTC 2005)",

}

Bartek, M, Sinaga, SM & Burghartz, JN 2005, Influence of via-connections on electrical performance of vertically-spaced rf passives. in s.n. (ed.), Proceedings of the the 55th electronic components and technology conference (ECTC 2005). IEEE Society, Piscataway, pp. 1584-1589, 55th electronic components and technology conference (ECTC 2005), Lake Buena Vista, FL, USA, 31/05/05.

Influence of via-connections on electrical performance of vertically-spaced rf passives. / Bartek, M; Sinaga, SM; Burghartz, JN.
Proceedings of the the 55th electronic components and technology conference (ECTC 2005). ed. / s.n. Piscataway: IEEE Society, 2005. p. 1584-1589.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Influence of via-connections on electrical performance of vertically-spaced rf passives

AU - Bartek, M

AU - Sinaga, SM

AU - Burghartz, JN

N1 - Editor onbekend JH

PY - 2005

Y1 - 2005

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-8906-9

SP - 1584

EP - 1589

BT - Proceedings of the the 55th electronic components and technology conference (ECTC 2005)

A2 - s.n., null

PB - IEEE Society

CY - Piscataway

T2 - 55th electronic components and technology conference (ECTC 2005), Lake Buena Vista, FL, USA

Y2 - 31 May 2005 through 3 June 2005

ER -