Abstract
This paper reports on fabrication and design considerations of an integrated folded shorted-patch chip-size antenna for applications in short-range wireless microsystems and operating inside the 5¿6 GHz ISM band. Antenna fabrication is based on wafer-level chip-scale packaging (WLCSP) techniques and consists of two adhesively bonded glass wafers with patterned metallization and through-wafer electrical interconnects. Via formation in glass substrates is identified as the key fabrication step. Various options for via formation are compared and from these, a 193 nm excimer laser ablation is selected for fabrication of the antenna demonstrator. The fabricated antenna has dimensions of 4 mm × 4 mm × 1 mm, measured operating frequency of 5.05 GHz with a bandwidth of 200 MHz at the return loss of ¿10 dB and a simulated radiation efficiency of 60% were achieved.
Keywords: Chip-size antenna; Wafer-level packaging; Wireless microsystem; Excimer laser ablation; Via fabrication
| Original language | Undefined/Unknown |
|---|---|
| Pages (from-to) | 217-222 |
| Number of pages | 6 |
| Journal | Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers |
| Volume | 125 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - 2006 |
Keywords
- academic journal papers
- CWTS 0.75 <= JFIS < 2.00