Integrating low temperature aligned carbon nanotubes as vertical interconnects in Si technology

S Vollebregt; R Ishihara; J Derakhshandeh; J van der Cingel; H Schellevis; CIM Beenakker

doi:10.1109/NANO.2011.6144393

Integrating low temperature aligned carbon nanotubes as vertical interconnects in Si technology

S Vollebregt, R Ishihara, J Derakhshandeh, J van der Cingel, H Schellevis, CIM Beenakker

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

20 Citations (Scopus)

Original language	English
Title of host publication	11th IEEE International Conference on Nanotechnology (NANO 2011)
Editors	JE Morris, S Rung, S Goodnick
Place of Publication	Portland, OR, USA
Publisher	IEEE
Pages	985-990
Number of pages	6
ISBN (Print)	978-1-4577-1515-0
DOIs	https://doi.org/10.1109/NANO.2011.6144393
Publication status	Published - 2011
Event	11th IEEE NANO 2011 - Portland, OR, USA Duration: 15 Aug 2011 → 19 Aug 2011

Publication series

Name
Publisher	IEEE

Conference

Conference	11th IEEE NANO 2011
Period	15/08/11 → 19/08/11

Keywords

Conf.proc. > 3 pag

Access to Document

10.1109/NANO.2011.6144393

Cite this

Vollebregt, S., Ishihara, R., Derakhshandeh, J., van der Cingel, J., Schellevis, H., & Beenakker, CIM. (2011). Integrating low temperature aligned carbon nanotubes as vertical interconnects in Si technology. In JE. Morris, S. Rung, & S. Goodnick (Eds.), 11th IEEE International Conference on Nanotechnology (NANO 2011) (pp. 985-990). IEEE. https://doi.org/10.1109/NANO.2011.6144393

@inproceedings{784b3240e3b44fe58dc791106ed14a85,

title = "Integrating low temperature aligned carbon nanotubes as vertical interconnects in Si technology",

keywords = "Conf.proc. > 3 pag",

author = "S Vollebregt and R Ishihara and J Derakhshandeh and {van der Cingel}, J and H Schellevis and CIM Beenakker",

year = "2011",

doi = "10.1109/NANO.2011.6144393",

language = "English",

isbn = "978-1-4577-1515-0",

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pages = "985--990",

editor = "JE Morris and S Rung and S Goodnick",

booktitle = "11th IEEE International Conference on Nanotechnology (NANO 2011)",

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note = "11th IEEE NANO 2011 ; Conference date: 15-08-2011 Through 19-08-2011",

}

Vollebregt, S , Ishihara, R, Derakhshandeh, J, van der Cingel, J , Schellevis, H & Beenakker, CIM 2011, Integrating low temperature aligned carbon nanotubes as vertical interconnects in Si technology. in JE Morris, S Rung & S Goodnick (eds), 11th IEEE International Conference on Nanotechnology (NANO 2011). IEEE, Portland, OR, USA, pp. 985-990, 11th IEEE NANO 2011, 15/08/11. https://doi.org/10.1109/NANO.2011.6144393

Integrating low temperature aligned carbon nanotubes as vertical interconnects in Si technology. / Vollebregt, S ; Ishihara, R; Derakhshandeh, J et al.
11th IEEE International Conference on Nanotechnology (NANO 2011). ed. / JE Morris; S Rung; S Goodnick. Portland, OR, USA: IEEE, 2011. p. 985-990.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Integrating low temperature aligned carbon nanotubes as vertical interconnects in Si technology

AU - Vollebregt, S

AU - Ishihara, R

AU - Derakhshandeh, J

AU - van der Cingel, J

AU - Schellevis, H

AU - Beenakker, CIM

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BT - 11th IEEE International Conference on Nanotechnology (NANO 2011)

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PB - IEEE

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T2 - 11th IEEE NANO 2011

Y2 - 15 August 2011 through 19 August 2011

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