Integrating low-temperature carbon nanotubes as vertical interconnects in Si technology

Research output: Chapter in Book/Conference proceedings/Edited volume › Chapter › Scientific

Original language	English
Title of host publication	Nanoelectronic Device Applications Handbook
Editors	JE Morris, I Krzysztof
Place of Publication	Boca Raton, FL, USA
Publisher	CRC Press
Pages	423-436
Number of pages	940
ISBN (Print)	9781466565234
Publication status	Published - 2013

Cite this

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title = "Integrating low-temperature carbon nanotubes as vertical interconnects in Si technology",

author = "S Vollebregt and R Ishihara and {Derakhshandeh Kheljani}, J and {van der Cingel}, J and CIM Beenakker",

year = "2013",

language = "English",

isbn = "9781466565234",

pages = "423--436",

editor = "JE Morris and I Krzysztof",

booktitle = "Nanoelectronic Device Applications Handbook",

publisher = "CRC Press",

}

Integrating low-temperature carbon nanotubes as vertical interconnects in Si technology. / Vollebregt, S ; Ishihara, R; Derakhshandeh Kheljani, J et al.
Nanoelectronic Device Applications Handbook. ed. / JE Morris; I Krzysztof. Boca Raton, FL, USA: CRC Press, 2013. p. 423-436.

Research output: Chapter in Book/Conference proceedings/Edited volume › Chapter › Scientific

TY - CHAP

T1 - Integrating low-temperature carbon nanotubes as vertical interconnects in Si technology

AU - Vollebregt, S

AU - Ishihara, R

AU - Derakhshandeh Kheljani, J

AU - van der Cingel, J

AU - Beenakker, CIM

PY - 2013

Y1 - 2013

UR - http://www.crcpress.com/product/isbn/9781466565234

M3 - Chapter

SN - 9781466565234

SP - 423

EP - 436

BT - Nanoelectronic Device Applications Handbook

A2 - Morris, JE

A2 - Krzysztof, I

PB - CRC Press

CY - Boca Raton, FL, USA

ER -