Integration of laser die transfer and magnetic self-assembly for ultra-thin chip placement

EE Kuran, Y Berg, M Tichem, Z Kotler

Research output: Contribution to journalArticleScientificpeer-review

6 Citations (Scopus)
Original languageEnglish
Pages (from-to)1-7
Number of pages7
JournalJournal of Micromechanics and Microengineering
Volume25
Issue number4
DOIs
Publication statusPublished - 2015

Bibliographical note

Harvest

Keywords

  • CWTS 0.75 <= JFIS < 2.00

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