Integration of laser die transfer and magnetic self-assembly for ultra-thin chip placement

EE Kuran; Y Berg; M Tichem; Z Kotler

doi:10.1088/0960-1317/25/4/045008

Integration of laser die transfer and magnetic self-assembly for ultra-thin chip placement

EE Kuran, Y Berg, M Tichem, Z Kotler

Micro and Nano Engineering

Research output: Contribution to journal › Article › Scientific › peer-review

8 Citations (Scopus)

Original language	English
Pages (from-to)	1-7
Number of pages	7
Journal	Journal of Micromechanics and Microengineering
Volume	25
Issue number	4
DOIs	https://doi.org/10.1088/0960-1317/25/4/045008
Publication status	Published - 2015

Bibliographical note

Harvest

Keywords

CWTS 0.75 <= JFIS < 2.00

Access to Document

10.1088/0960-1317/25/4/045008

Cite this

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title = "Integration of laser die transfer and magnetic self-assembly for ultra-thin chip placement",

keywords = "CWTS 0.75 <= JFIS < 2.00",

author = "EE Kuran and Y Berg and M Tichem and Z Kotler",

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doi = "10.1088/0960-1317/25/4/045008",

language = "English",

volume = "25",

pages = "1--7",

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issn = "0960-1317",

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AU - Kuran, EE

AU - Berg, Y

AU - Tichem, M

AU - Kotler, Z

N1 - Harvest

PY - 2015

Y1 - 2015

KW - CWTS 0.75 <= JFIS < 2.00

U2 - 10.1088/0960-1317/25/4/045008

DO - 10.1088/0960-1317/25/4/045008

M3 - Article

VL - 25

SP - 1

EP - 7

JO - Journal of Micromechanics and Microengineering

JF - Journal of Micromechanics and Microengineering

SN - 0960-1317

IS - 4

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