TY - GEN
T1 - Interconnect and packaging technologies for terahertz communication systems
AU - Chattopadhyay, Goutam
AU - Reck, Theodore
AU - Jung-Kubiak, Cecile
AU - Alonso-Delpino, Maria
AU - Lee, Choonsup
PY - 2017/5/15
Y1 - 2017/5/15
N2 - Using newly developed silicon micromachining technology that enables low-loss and highly integrated packaging solutions, we are developing vertically stacked transmitters and receivers at terahertz frequencies that can be used for communication and other terahertz systems. Although there are multiple ways to address the problem of interconnect and packaging solutions at these frequencies, such as system-on-package (SOP), multi-chip modules (MCM), substrate integrated waveguide (SIW), liquid crystal polymer (LCP) based multilayer technologies, and others, we show that deep reactive ion etching (DRIE) based silicon micromachining with vertical integration allows the most effective solutions at terahertz frequencies.
AB - Using newly developed silicon micromachining technology that enables low-loss and highly integrated packaging solutions, we are developing vertically stacked transmitters and receivers at terahertz frequencies that can be used for communication and other terahertz systems. Although there are multiple ways to address the problem of interconnect and packaging solutions at these frequencies, such as system-on-package (SOP), multi-chip modules (MCM), substrate integrated waveguide (SIW), liquid crystal polymer (LCP) based multilayer technologies, and others, we show that deep reactive ion etching (DRIE) based silicon micromachining with vertical integration allows the most effective solutions at terahertz frequencies.
KW - DRIE
KW - interconnects
KW - Micromachining
KW - packaging
KW - Terahertz
UR - http://www.scopus.com/inward/record.url?scp=85020182676&partnerID=8YFLogxK
U2 - 10.23919/EuCAP.2017.7928794
DO - 10.23919/EuCAP.2017.7928794
M3 - Conference contribution
AN - SCOPUS:85020182676
T3 - 2017 11th European Conference on Antennas and Propagation, EUCAP 2017
SP - 1646
EP - 1649
BT - 2017 11th European Conference on Antennas and Propagation, EUCAP 2017
PB - Institute of Electrical and Electronics Engineers (IEEE)
T2 - 11th European Conference on Antennas and Propagation, EUCAP 2017
Y2 - 19 March 2017 through 24 March 2017
ER -