Interconnect and packaging technologies for terahertz communication systems

Goutam Chattopadhyay, Theodore Reck, Cecile Jung-Kubiak, Maria Alonso-Delpino, Choonsup Lee

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

Using newly developed silicon micromachining technology that enables low-loss and highly integrated packaging solutions, we are developing vertically stacked transmitters and receivers at terahertz frequencies that can be used for communication and other terahertz systems. Although there are multiple ways to address the problem of interconnect and packaging solutions at these frequencies, such as system-on-package (SOP), multi-chip modules (MCM), substrate integrated waveguide (SIW), liquid crystal polymer (LCP) based multilayer technologies, and others, we show that deep reactive ion etching (DRIE) based silicon micromachining with vertical integration allows the most effective solutions at terahertz frequencies.

Original languageEnglish
Title of host publication2017 11th European Conference on Antennas and Propagation, EUCAP 2017
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Pages1646-1649
Number of pages4
ISBN (Electronic)9788890701870
DOIs
Publication statusPublished - 15 May 2017
Externally publishedYes
Event11th European Conference on Antennas and Propagation, EUCAP 2017 - Paris, France
Duration: 19 Mar 201724 Mar 2017

Publication series

Name2017 11th European Conference on Antennas and Propagation, EUCAP 2017

Conference

Conference11th European Conference on Antennas and Propagation, EUCAP 2017
CountryFrance
CityParis
Period19/03/1724/03/17

Keywords

  • DRIE
  • interconnects
  • Micromachining
  • packaging
  • Terahertz

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