Interconnect and thermal aware 3D design space exploration

SS Kumar, A Aggarwal, R Jagtap, A Zjajo, TGRM van Leuken

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	English
Title of host publication	Proceedings ICT.OPEN 2013
Editors	D Stroobandt, W Segeth
Place of Publication	Utrecht
Publisher	STW
Pages	-
Publication status	Published - 2013
Event	ICT.OPEN 2013 - Utrecht Duration: 27 Nov 2013 → 28 Nov 2013

Name
Publisher	STW

Conference	ICT.OPEN 2013
Period	27/11/13 → 28/11/13

Cite this

@inproceedings{17672250920c4ed0812f6fa2b7f9b89f,

title = "Interconnect and thermal aware 3D design space exploration",

author = "SS Kumar and A Aggarwal and R Jagtap and A Zjajo and {van Leuken}, TGRM",

year = "2013",

language = "English",

publisher = "STW",

pages = "--",

editor = "D Stroobandt and W Segeth",

booktitle = "Proceedings ICT.OPEN 2013",

note = "ICT.OPEN 2013 ; Conference date: 27-11-2013 Through 28-11-2013",

}

TY - GEN

T1 - Interconnect and thermal aware 3D design space exploration

AU - Kumar, SS

AU - Aggarwal, A

AU - Jagtap, R

AU - Zjajo, A

AU - van Leuken, TGRM

PY - 2013

Y1 - 2013

UR - http://www.ictopen2013.nl/content/proceedings+2012

M3 - Conference contribution

SP - -

BT - Proceedings ICT.OPEN 2013

A2 - Stroobandt, D

A2 - Segeth, W

PB - STW

CY - Utrecht

T2 - ICT.OPEN 2013

Y2 - 27 November 2013 through 28 November 2013

ER -