@inproceedings{d11d167466bd4a05b57170da97c35687,
title = "Interconnect test for 3D stacked memory-on-logic",
author = "M Taouil and M Masadeh and S Hamdioui and EJ Marinissen",
year = "2014",
doi = "10.7873/DATE.2014.139",
language = "English",
isbn = "978-3-9815370-2-4",
publisher = "EDAA",
pages = "1--6",
editor = "W Nebel and G Fettweis",
booktitle = "Proceedings of the 2014 International Conference on Design, Automation & Test in Europe",
note = "DATE '14, Dresden, Germany ; Conference date: 24-03-2014 Through 28-03-2014",
}