Interconnect test for 3D stacked memory-on-logic

M Taouil, M Masadeh, S Hamdioui, EJ Marinissen

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

8 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings of the 2014 International Conference on Design, Automation & Test in Europe
EditorsW Nebel, G Fettweis
Place of PublicationLeuven, Belgium
PublisherEDAA
Pages1-6
Number of pages6
ISBN (Print)978-3-9815370-2-4
DOIs
Publication statusPublished - 2014
EventDATE '14, Dresden, Germany - Leuven, Belgium
Duration: 24 Mar 201428 Mar 2014

Publication series

Name
PublisherEDAA

Conference

ConferenceDATE '14, Dresden, Germany
Period24/03/1428/03/14

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