Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

Zhen Cui, Yingying Zhang, Qun Yang, Guoqi Zhang, Xianping Chen*

*Corresponding author for this work

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)
30 Downloads (Pure)


Interfacial properties of Cu/SiO2 in semiconductor devices has been a challenging study for many years because of its difficulties in experimentally quantifying the critical strength of interface. In this paper, a multi-scale modeling approach is built to characterize the interfacial properties between Cu and SiO2. The Cu and SiO2 are bonded by three types of chemical bonds, which cause three atomistic interfacial structures. The fracture of Cu-O and Cu-Si bonded interfaces occur at the interface, however, the fracture for Cu-OO interface occurs at copper layer near the interface, indicating two different fracture criterions coexist in Cu/SiO2 system.

Original languageEnglish
Title of host publication Proceedings - 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018
Place of PublicationPiscataway, NJ
Number of pages3
ISBN (Electronic)978-1-5386-3712-8
Publication statusPublished - 2018
EventEDTM 2018: 2nd Electron Devices Technology and Manufacturing (EDTM) Conference - Kobe, Japan
Duration: 13 Mar 201816 Mar 2018
Conference number: 2


ConferenceEDTM 2018
Internet address

Bibliographical note

Accepted author manuscript


  • Load modeling
  • Loading
  • Substrates
  • Copper
  • Adhesives
  • Solid modeling
  • Computational modeling


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