Interfacial fracture parameters of silicon-to-molding compound

Engineering

• Ball Grid Arrays 33%
• Computer Simulation 33%
• Crack Length 33%
• Crack Tip Position 33%
• Delamination 66%
• Design 33%
• Development 33%
• Digital Image Correlation 33%
• Energy Release Rate 33%
• Experiments 33%
• External Load 33%
• Fracture Parameter 100%
• Impact Toughness 33%
• Integrated System 33%
• Load Angle 33%
• Material Layer 33%
• Mechanical Fracture 66%
• Mixed Mode 33%
• Models 33%
• Moulding Process 33%
• Numerical Modeling 33%
• Stress State 66%
• Tensiles 33%

Material Science

• Fracture Toughness 33%
• Mechanical Property 33%
• Microelectronics 33%
• Residual Stress 66%
• Sheet Molding Compounds 100%
• Short Crack 33%
• Silicon 100%

INIS

• diversification 16%