Interfacial fracture properties of Cu-EMC interfaces at pressure cooker test conditions

M Sadeghinia, KMB Jansen, LJ Ernst, H Pape

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
PublisherIEEE Society
Pages752-755
Number of pages4
ISBN (Print)978-1-4673-1965-2
Publication statusPublished - 2012

Publication series

Name
PublisherIEEE

Keywords

  • Conf.proc. > 3 pag

Cite this

Sadeghinia, M., Jansen, KMB., Ernst, LJ., & Pape, H. (2012). Interfacial fracture properties of Cu-EMC interfaces at pressure cooker test conditions. In Proceedings Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd (pp. 752-755). IEEE Society.