Interfacial fracture properties of Cu-EMC interfaces at pressure cooker test conditions

M Sadeghinia, KMB Jansen, LJ Ernst, H Pape

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

3 Citations (Scopus)

Original language	English
Title of host publication	Proceedings Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Publisher	IEEE
Pages	752-755
Number of pages	4
ISBN (Print)	978-1-4673-1965-2
Publication status	Published - 2012

Name
Publisher	IEEE

Keywords

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title = "Interfacial fracture properties of Cu-EMC interfaces at pressure cooker test conditions",

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language = "English",

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Interfacial fracture properties of Cu-EMC interfaces at pressure cooker test conditions. / Sadeghinia, M; Jansen, KMB; Ernst, LJ et al.
Proceedings Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. IEEE, 2012. p. 752-755.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Interfacial fracture properties of Cu-EMC interfaces at pressure cooker test conditions

AU - Sadeghinia, M

AU - Jansen, KMB

AU - Ernst, LJ

AU - Pape, H

PY - 2012

Y1 - 2012

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4673-1965-2

SP - 752

EP - 755

BT - Proceedings Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd

PB - IEEE

ER -