Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes

Y Liu, F Sun, H Zhang, T Xin, CA Yuan, GQ Zhang

Research output: Contribution to journalArticleScientificpeer-review

15 Citations (Scopus)
Original languageEnglish
Pages (from-to)1234-1240
Number of pages7
JournalMicroelectronics Reliability
Volume55
Issue number8
DOIs
Publication statusPublished - 2015

Bibliographical note

Harvest
Available online 23-5-2015

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