Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes

Y Liu, F Sun, H Zhang, T Xin, CA Yuan, GQ Zhang

Research output: Contribution to journal › Article › Scientific › peer-review

18 Citations (Scopus)

Original language	English
Pages (from-to)	1234-1240
Number of pages	7
Journal	Microelectronics Reliability
Volume	55
Issue number	8
DOIs	https://doi.org/10.1016/j.microrel.2015.05.005
Publication status	Published - 2015

Harvest
Available online 23-5-2015

Access to Document

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title = "Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes",

author = "Y Liu and F Sun and H Zhang and T Xin and CA Yuan and GQ Zhang",

note = "Harvest Available online 23-5-2015",

year = "2015",

doi = "10.1016/j.microrel.2015.05.005",

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TY - JOUR

T1 - Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes

AU - Liu, Y

AU - Sun, F

AU - Zhang, H

AU - Xin, T

AU - Yuan, CA

AU - Zhang, GQ

N1 - Harvest Available online 23-5-2015

PY - 2015

Y1 - 2015

U2 - 10.1016/j.microrel.2015.05.005

DO - 10.1016/j.microrel.2015.05.005

M3 - Article

SN - 0026-2714

VL - 55

SP - 1234

EP - 1240

JO - Microelectronics Reliability

JF - Microelectronics Reliability

IS - 8

ER -