Fingerprint
Dive into the research topics of 'Interfacial strength of silicon-to-molding compound changes with thermal residual stress'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Interfacial strength of silicon-to-molding compound changes with thermal residual stress
G Schlottig, A Xiao, H Pape, B Wunderle, LJ Ernst
Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
6
Citations
(Scopus)