Abstract
Electronic packages with solder interconnects, such as Chip Scale Packages (CSP) and Ball Grid Arrays (BGA), are extensively utilized in various applications, including cell phones, smartwatches, and electric vehicles. The advancements in technology and the features within these applications have led to an increase in power cycles within the packages. This combined with a reduced time to market makes their reliability testing more challenging. With the increased power cycles, even the small temperature variations (ΔT) within an Integrated Circuit (IC) package contribute to the increased susceptibility of devices to failures, often triggering a complex interplay of competing failure modes. Thus, it is crucial to understand the interplay between various failure mechanisms in real-world scenarios for evaluating and overseeing the dependability and efficiency of electronic systems. This paper presents an overview of the impact of small temperature variations on component reliability. In addition, a simulation-based preliminary study is carried out on a Wafer-Level Chip Scale Package (WLCSP) by implementing a thermal load corresponding to an active power cycle. The results are analyzed to locate possible failure locations within the solder bumps based on the accumulated plastic strains for different amplitudes of thermal load (ΔT). Finally, the necessity for a new testing strategy based on variable (ΔT) is highlighted.
Original language | English |
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Title of host publication | Proceedings of the 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) |
Publisher | IEEE |
Number of pages | 6 |
ISBN (Electronic) | 979-8-3503-9036-0 |
ISBN (Print) | 979-8-3503-9037-7 |
DOIs | |
Publication status | Published - 2024 |
Event | 10th IEEE Electronics System-Integration Technology Conference, ESTC 2024 - Berlin, Germany Duration: 11 Sept 2024 → 13 Sept 2024 |
Conference
Conference | 10th IEEE Electronics System-Integration Technology Conference, ESTC 2024 |
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Country/Territory | Germany |
City | Berlin |
Period | 11/09/24 → 13/09/24 |
Bibliographical note
Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-careOtherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Keywords
- component
- failure modes
- long lifetime
- temperature variations