Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

DG Yang, GQ Zhang, LJ Ernst, C van t Hof, JFJM Caers, HJL Bressers, JHJ Janssen

Research output: Contribution to journalArticleScientificpeer-review

20 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)388-398
Number of pages11
JournalIEEE Transactions on Components and Packaging Technology
Issue number2
Publication statusPublished - 2003


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