Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

DG Yang, GQ Zhang, LJ Ernst, C van t Hof, JFJM Caers, HJL Bressers, JHJ Janssen

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	Undefined/Unknown
Pages (from-to)	388-398
Number of pages	11
Journal	IEEE Transactions on Components and Packaging Technology
Volume	26
Issue number	2
Publication status	Published - 2003

Keywords

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title = "Investigation on flip chip solder joint fatigue with cure-dependent underfill properties",

keywords = "ZX CWTS JFIS < 1.00",

author = "DG Yang and GQ Zhang and LJ Ernst and {van t Hof}, C and JFJM Caers and HJL Bressers and JHJ Janssen",

year = "2003",

language = "Undefined/Unknown",

volume = "26",

pages = "388--398",

journal = "IEEE Transactions on Components and Packaging Technology",

issn = "1521-3331",

publisher = "IEEE",

number = "2",

}

TY - JOUR

T1 - Investigation on flip chip solder joint fatigue with cure-dependent underfill properties

AU - Yang, DG

AU - Zhang, GQ

AU - Ernst, LJ

AU - van t Hof, C

AU - Caers, JFJM

AU - Bressers, HJL

AU - Janssen, JHJ

PY - 2003

Y1 - 2003

KW - ZX CWTS JFIS < 1.00

M3 - Article

SN - 1521-3331

VL - 26

SP - 388

EP - 398

JO - IEEE Transactions on Components and Packaging Technology

JF - IEEE Transactions on Components and Packaging Technology

IS - 2

ER -