Is TSV-based 3D integration suitable for inter-die memory repair?

M Lefter, GR Voicu, M Taouil, M Enachescu, S Hamdioui, SD Cotofana

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

5 Citations (Scopus)
Original languageEnglish
Title of host publicationDesign, automation & test in Europe conference & exhibition
Editors s.n.
Place of PublicationPiscataway
PublisherIEEE Society
Pages1-4
Number of pages4
ISBN (Print)978-3-9815370-0-0
Publication statusPublished - 2013
EventDATE 2013 - Piscataway
Duration: 18 Mar 201322 Mar 2013

Publication series

Name
PublisherIEEE

Conference

ConferenceDATE 2013
Period18/03/1322/03/13

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