Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling

Minne Liu, Wenyu Li, Wei Chen, Mesfin S. Ibrahim, Jingkang Xiong, Guoqi Zhang, Jiajie Fan*

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

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Abstract

During the operation of an LED array, its thermal and optical performances are always not equal to the superposition of the individual LED's characteristics because of a significant thermal coupling effect between the arrays. Based on this, this paper proposes an electrical–photo-thermal model, with considering both junction temperature and luminous flux, to predict the both the thermal and optical performances of LED arrays operated under different currents, case temperatures, and lighting methods. The junction temperature and luminous flux of a single LED operating under different driving currents and case temperature conditions are firstly collected to establish the luminous flux response surface model of a single chip. Then it is used to predict the luminous flux of an array, whose junction temperature is predicted using both thermal coupling matrix (TCM) and numerical models. Experiments verify the luminous flux of the LED array under different operation conditions and show that the proposed electrical–photo-thermal modeling can be used to predict the thermal and optical parameters of LED arrays with 95 % accuracy. Thus, it is effective for the fast prediction of the junction temperature and luminous flux of large LED systems with array structures, i.e. intelligent automotive lightings and displays.

Original languageEnglish
Article number103940
Number of pages16
JournalCase Studies in Thermal Engineering
Volume54
DOIs
Publication statusPublished - 2024

Keywords

  • Electrical-photo-thermal modeling
  • Junction temperature
  • Light-emitting diode
  • Luminous flux
  • Multiple-chip array
  • Thermal coupling

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