Junction temperature measurement to optimize thermal design of LED arrays

Huaiyu Ye, Hongyu Tang, Stanley Leung, Cheng Qian, Xuejun Fan, Guoqi Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

4 Citations (Scopus)

Abstract

The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance and junction temperature is very important in the design. However, because direct junction temperature determination is hard to detect due to the encapsulation, indirect methods are more preferred. Among them, the diode forward-voltage method is the most accurate one. Therefore, we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.
Original languageEnglish
Title of host publication12th China International Forum on Solid State Lighting, SSLCHINA 2015
Place of PublicationPiscataway, NJ
PublisherIEEE Society
Pages47-51
Number of pages5
ISBN (Electronic)978-1-5090-0176-7
ISBN (Print)978-1-5090-0175-0
DOIs
Publication statusPublished - Nov 2015
Event12th China International Forum on Solid State Lighting - Shenzhen, China
Duration: 2 Nov 20154 Nov 2015
Conference number: 12

Conference

Conference12th China International Forum on Solid State Lighting
Abbreviated titleSSLChina 2015
CountryChina
CityShenzhen
Period2/11/154/11/15

Keywords

  • Light emitting diodes
  • Temperature measurement
  • Junctions
  • Phosphors
  • Heat sinks
  • Temperature distribution

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