Junction temperature measurement to optimize thermal design of LED arrays

Huaiyu Ye; Hongyu Tang; Stanley Leung; Cheng Qian; Xuejun Fan; Guoqi Zhang

doi:10.1109/SSLCHINA.2015.7360687

Junction temperature measurement to optimize thermal design of LED arrays

Huaiyu Ye, Hongyu Tang, Stanley Leung, Cheng Qian, Xuejun Fan, Guoqi Zhang

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

4 Citations (Scopus)

Abstract

The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance and junction temperature is very important in the design. However, because direct junction temperature determination is hard to detect due to the encapsulation, indirect methods are more preferred. Among them, the diode forward-voltage method is the most accurate one. Therefore, we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.

Original language	English
Title of host publication	12th China International Forum on Solid State Lighting, SSLCHINA 2015
Place of Publication	Piscataway, NJ
Publisher	IEEE Society
Pages	47-51
Number of pages	5
ISBN (Electronic)	978-1-5090-0176-7
ISBN (Print)	978-1-5090-0175-0
DOIs	https://doi.org/10.1109/SSLCHINA.2015.7360687
Publication status	Published - Nov 2015
Event	12th China International Forum on Solid State Lighting - Shenzhen, China Duration: 2 Nov 2015 → 4 Nov 2015 Conference number: 12

Conference

Conference	12th China International Forum on Solid State Lighting
Abbreviated title	SSLChina 2015
Country/Territory	China
City	Shenzhen
Period	2/11/15 → 4/11/15

Keywords

Light emitting diodes
Temperature measurement
Junctions
Phosphors
Heat sinks
Temperature distribution

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10.1109/SSLCHINA.2015.7360687

Cite this

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title = "Junction temperature measurement to optimize thermal design of LED arrays",

abstract = "The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance and junction temperature is very important in the design. However, because direct junction temperature determination is hard to detect due to the encapsulation, indirect methods are more preferred. Among them, the diode forward-voltage method is the most accurate one. Therefore, we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.",

keywords = "Light emitting diodes, Temperature measurement, Junctions, Phosphors, Heat sinks, Temperature distribution",

author = "Huaiyu Ye and Hongyu Tang and Stanley Leung and Cheng Qian and Xuejun Fan and Guoqi Zhang",

year = "2015",

month = nov,

doi = "10.1109/SSLCHINA.2015.7360687",

language = "English",

isbn = "978-1-5090-0175-0",

pages = "47--51",

booktitle = "12th China International Forum on Solid State Lighting, SSLCHINA 2015",

publisher = "IEEE Society",

note = "12th China International Forum on Solid State Lighting, SSLChina 2015 ; Conference date: 02-11-2015 Through 04-11-2015",

}

Ye, H, Tang, H, Leung, S, Qian, C, Fan, X & Zhang, G 2015, Junction temperature measurement to optimize thermal design of LED arrays. in 12th China International Forum on Solid State Lighting, SSLCHINA 2015. IEEE Society, Piscataway, NJ, pp. 47-51, 12th China International Forum on Solid State Lighting, Shenzhen, China, 2/11/15. https://doi.org/10.1109/SSLCHINA.2015.7360687

TY - GEN

T1 - Junction temperature measurement to optimize thermal design of LED arrays

AU - Ye, Huaiyu

AU - Tang, Hongyu

AU - Leung, Stanley

AU - Qian, Cheng

AU - Fan, Xuejun

AU - Zhang, Guoqi

N1 - Conference code: 12

PY - 2015/11

Y1 - 2015/11

N2 - The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance and junction temperature is very important in the design. However, because direct junction temperature determination is hard to detect due to the encapsulation, indirect methods are more preferred. Among them, the diode forward-voltage method is the most accurate one. Therefore, we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.

AB - The drive to increase electrical currents input, and to achieve high lumen output for High Brightness Light Emitting Diode (HB LED) has led to a series of thermal problems. Hence, thermal management is one of key design parameters as the temperature directly affecting the maximum light output, quality, reliability and life time. For LED arrays, the arrangement of chips will affect the thermal performance and junction temperature is very important in the design. However, because direct junction temperature determination is hard to detect due to the encapsulation, indirect methods are more preferred. Among them, the diode forward-voltage method is the most accurate one. Therefore, we used the diode forward-voltage method to optimize thermal design of LED arrays in this work.

KW - Light emitting diodes

KW - Temperature measurement

KW - Junctions

KW - Phosphors

KW - Heat sinks

KW - Temperature distribution

UR - http://resolver.tudelft.nl/uuid://a63e07e5-00cb-4099-b46b-60b7ec80fdf4

U2 - 10.1109/SSLCHINA.2015.7360687

DO - 10.1109/SSLCHINA.2015.7360687

M3 - Conference contribution

SN - 978-1-5090-0175-0

SP - 47

EP - 51

BT - 12th China International Forum on Solid State Lighting, SSLCHINA 2015

PB - IEEE Society

CY - Piscataway, NJ

T2 - 12th China International Forum on Solid State Lighting

Y2 - 2 November 2015 through 4 November 2015

ER -

Junction temperature measurement to optimize thermal design of LED arrays

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