Large-area silicon electronics using stretchable metal interconnect

S Sosin; T Zoumpoulidis; M Bartek; R Dekker

Large-area silicon electronics using stretchable metal interconnect

S Sosin, T Zoumpoulidis, M Bartek, R Dekker

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proc. 59th Electronic Components & Technology Conference (ECTC 2009)
Editors	s.n.
Place of Publication	San Diego, CA
Publisher	IEEE Society
Pages	1059-1064
Number of pages	6
ISBN (Print)	978-1-4244-4476-2
Publication status	Published - 2009
Event	ECTC 2009 - San Diego, CA Duration: 27 May 2009 → 29 May 2009

Publication series

Name
Publisher	IEEE

Conference

Conference	ECTC 2009
Period	27/05/09 → 29/05/09

Keywords

Elektrotechniek
Techniek
Conf.proc. > 3 pag

Cite this

@inproceedings{55acf8529f974aa99f2cef39c84cbb1b,

title = "Large-area silicon electronics using stretchable metal interconnect",

keywords = "Elektrotechniek, Techniek, Conf.proc. > 3 pag",

author = "S Sosin and T Zoumpoulidis and M Bartek and R Dekker",

year = "2009",

language = "Undefined/Unknown",

isbn = "978-1-4244-4476-2",

publisher = "IEEE Society",

pages = "1059--1064",

editor = "s.n.",

booktitle = "Proc. 59th Electronic Components & Technology Conference (ECTC 2009)",

note = "ECTC 2009 ; Conference date: 27-05-2009 Through 29-05-2009",

}

Large-area silicon electronics using stretchable metal interconnect. / Sosin, S; Zoumpoulidis, T; Bartek, M et al.
Proc. 59th Electronic Components & Technology Conference (ECTC 2009). ed. / s.n. San Diego, CA: IEEE Society, 2009. p. 1059-1064.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Large-area silicon electronics using stretchable metal interconnect

AU - Sosin, S

AU - Zoumpoulidis, T

AU - Bartek, M

AU - Dekker, R

PY - 2009

Y1 - 2009

KW - Elektrotechniek

KW - Techniek

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-4476-2

SP - 1059

EP - 1064

BT - Proc. 59th Electronic Components & Technology Conference (ECTC 2009)

A2 - s.n., null

PB - IEEE Society

CY - San Diego, CA

T2 - ECTC 2009

Y2 - 27 May 2009 through 29 May 2009

ER -