Large, deterministic and tunable thermo-optic shift for all photonic platforms

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Abstract

Achieving high degree of tunability in photonic devices has been a focal point in the field of integrated photonics for several decades, enabling a wide range of applications from telecommunication and biochemical sensing to fundamental quantum photonic experiments. We introduce a novel technique to engineer the thermal response of photonic devices resulting in large and deterministic wavelength shifts across various photonic platforms, such as amorphous Silicon Carbide (a-SiC), Silicon Nitride (SiN) and Silicon-On-Insulator (SOI). In this paper, we demonstrate bi-directional thermal tuning of photonic devices fabricated on a single chip. Our method can be used to design high-sensitivity photonic temperature sensors, low-power Mach-Zehnder interferometers and more complex photonics circuits.

Original languageEnglish
Title of host publicationIntegrated Photonics Platforms III
EditorsRoel G. Baets, Peter O'Brien, Laurent Vivien
PublisherSPIE
Number of pages3
ISBN (Electronic)9781510673427
DOIs
Publication statusPublished - 2024
EventIntegrated Photonics Platforms III 2024 - Strasbourg, France
Duration: 7 Apr 202410 Apr 2024

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume13012
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceIntegrated Photonics Platforms III 2024
Country/TerritoryFrance
CityStrasbourg
Period7/04/2410/04/24

Keywords

  • deterministic integration
  • silicon carbide
  • silicon dioxide
  • strain
  • thermo-optic coefficient

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